by | Oct 19, 2024 | 2D materials, Aerospace, AGM, Angstron Materials, Audio, Development, Investment, Products, Research
Researchers from ISMN-CNR have introduced GrapheNet, a deep learning framework based on an Inception-Resnet architecture using image-like encoding of structural features for the prediction of the properties of nanographenes. Scheme of the GrapheNet framework. Image...
by | Oct 19, 2024 | 2D materials, Aerospace, AGM, Angstron Materials, Audio, Development, Investment, Products, Research
The European Investment Bank (EIB) is offering Italian materials manufacturer BeDimensional €20 million (almost USD$22 million) in venture debt financing to expand production of Few-Layer Graphene (FLG) and Few-Layer Hexagonal Boron Nitride (FLhBN or FLB).  EIB...
by | Oct 18, 2024 | 2D materials, Aerospace, AGM, Angstron Materials, Audio, Development, Investment, Products, Research
Researchers have developed a method to control the direction of heat flow in crystals. This miniature device could eventually be used to create advanced thermal-management systems in electronic devices to prevent overheating.
by | Oct 17, 2024 | 2D materials, Aerospace, AGM, Angstron Materials, Audio, Development, Investment, Products, Research
Versarien has announced it has raised £450,000 (almost USD$585,000) by way of a placing new ordinary shares in the capital of the Company. The net proceeds of the Placing will be used to further increase the Company’s in-house concrete and mortar testing...
by | Oct 16, 2024 | 2D materials, Aerospace, AGM, Angstron Materials, Audio, Development, Investment, Products, Research
Graphene Manufacturing Group (GMG) has provided a commercialization update on its THERMAL-XR Powered by GMG Graphene technology, highlighting ongoing customer engagements, testing, and industry recognition. At a recent event in Brisbane, GMG re-launched its product,...
by | Oct 15, 2024 | 2D materials, Aerospace, AGM, Angstron Materials, Audio, Development, Investment, Products, Research
Researchers produced 3D-printed, semiconductor-free logic gates, which perform computations in active electronic devices. As they don’t require semiconductor materials, they represent a step toward 3D printing an entire active electronic device.
